ADDITIONAL INFORMATION TO HELP OPTIMIZE OUR WORKING RELATIONSHIP
A developer of space flight printed circuit board assemblies (PCBAs) which were Class IIIA products and had to meet NASA requirements, had a circuit packaging challenge. Class IIIA PCBAs must have designed feature sizes that meet defined manufacturing processes. The circuit density created power distribution challenges.
A manufacturer of intelligent automotive communication systems needed a lot of functionality in a small package. The printed circuit board assembly (PCBA) included high density interconnect (HDI) with a microBGA.
A startup company focused on medical diagnostic imaging needed to develop a functioning, marketable prototype as quickly as possible. The development budget was limited and the customer wanted to limit the printed circuit board (PCB) layer count.
